Integrated with two sets of optical systems, ultraviolet and near-infrared,
and two sets of film thickness measurement algorithms
Capable of measuring the ultra wide thickness range of top silicon thick
ness in SOI process from 0 to 150um
Good repeatability of measurement: the repeatability of the 0-3um sample
is 0.02nm; 3-150um sample repeatability 0.006um
The light source is stable and durable, with a long service life, greatly
reducing the frequency and cost of equipment maintenance
Can interface with MES systems in wafer factories to achieve automated
production in the factory
Advantage
Adopting a dual optical probe and dual film thickness design,
it meets the measurement needs of customers for various
thicknesses of top silicon;
Ultra long lifespan light source, low maintenance cost;
High speed and high precision motion platform;
Feature
The global fitting algorithm is used for thin film measurement
to meet the accuracy requirements of thin film measurement;
The FFT thick film algorithm is used for thick film measurement,
greatly expanding the measurement range of the equipment;
