With built-in pre-aligner and robotic wafer transfer system;
Modular design optical unit, using mature Fourier infrared technology;
Infrared light sources and solid-state lasers and moisture-resistant designs
reduce maintenance costs (COO) and increase equipment uptime;
Equipped with Ura spectrum elements and epitaxial film thickness analysis system;
Fully compliant with SECS/GEM standards, SECS interface supports local control
operations, and the host performs remote control operations through HSMS/SECS-1
protocol;The user-friendly client-server architecture allows for fast data collection
and 2D or 3D imaging.
SEMI S2 certified
advantage
FTIR technology is used to achieve non-contact measurement
of elemental and epitaxial film thickness, while having high
operating capacity;
Ability to determine elemental and epitaxial thickness on
unpatterned or patterned wafers, and measure epitaxial
layers that have grown multiple layers;
User-friendly interface, convenient and quick program settings;
Equipped with FFU for cleanroom environments;
Semi S2 certification has good security.
features
Ability to distinguish between source and target cassettes;
Dual robot arms with platform design for high stability and
high productivity;
Maintenance-free interferometer designed with infrared light source and
solid-state laser, with high stability, low maintenance time and low
maintenance cost;
The optical system adopts ZnSe beam splitter and a DTGS detector with
room temperature;
The system software can be customized according to the customer's special
requirements.
