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CN
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EN
Home
About Avantsemi
Our Products
News center
Company News
Technical Information
Careers
Company culture
Corporate recruitment
Contact us
Application Areas
Application Areas
Defect detection of super doped top layer silicon SOI bonding interface
Defect detection of graphic wafer hybrid bonding interface
Detection of carbon and oxygen concentration in 12-inch wafers
Si substrate and epitaxial testing
GaN detection
SiC substrates and epitaxial testing
Lithium niobate and lithium tantalate substrate detection
12-inch wafer bonding and wafer endogenous defect detection (holes, cracks, wafer bubbles, stress, etc.)
Integration of CMP, ETCH, CVD and other major process equipment
Post-wafer bonding defect detection in advanced packaging
Si Substrate Epitaxial Layer Thickness Measurement (6&8&12")
Thickness measurement of epitaxial layer on SiC substrate (4&6&8")
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