Industry standard robotic wafer transport system with built-in pre-aligner
Modularly designed optical units with proven Avant Semi FTIR technology
Air cooled IR source and solid-state laser and moisture protection design allows lower cost of ownership (COO) and increased equipment uptime
Eos200 is fully SECS/GEM compliant; SECS interface supports local control operation as
well as remote control operation by the Host via HSMS/SECS-1 protocols.
User-friendly GUI with client server architecture allows fast data collection and two- or three-dimensions mapping
SEMI S2 certified
Benefits
Contact-less measurement of epitaxial thickness by FTIR technique with very high operation throughput
Ability to determine epitaxial thickness on bulk or on patterned wafers such as silicon, SiC, GaAs, etc. It is also capable of measuring multiple grown epitaxial layers
Measurements are traceable to internal Golden Standards
Friendly user interface with convenient and fast recipe setup
Features
Ability to sort between source and destination cassettes
Patented Fixed-Reference-on-Chuck standard without the need for background wafer
Dual robot arms with stage design allows high stability and throughput
Service-free interferometer with air cooled IR source and solid-state laser design provides high stability and lower PM time and lower COO
Optical system utilizes ZnSe beam splitter and window with room temperature DTGS detector which does not require nitrogen purge for moisture protection, resulting in lowered COO
Ability to provide certain customization for system software upon customer special request
