Compatible with 4, 6 and 8 inch wafer inspection;
Industry-standard robotic wafer transfer system with built-in pre-aligner;
Imaging system with laser focusing, high-speed rotating point scanning;
self-made modular optical cavity;
Self-developed multi-channel defect detection algorithm and friendly
software operation interface;
SEMI S2 and CE certified;
Advantage
Provide non-destructive defect detection solutions;
Equipped with 5000RPM Spindle, high throughput;
Sensitivity up to 60nm PSL/Si wafer;
Equipped with 320nm, 355nm and 405nm laser light sources, so as
to match and be compatible with silicon carbide substrates and epitaxy;
Collect multi-wavelength photoluminescence signals to distinguish different defects;
User-friendly interface, simple operation process;
