It is compatible with 6&8 inch SiC&Si substrates and epitaxial wafer edge inspection, and is also suitable for edge defect detection of other compound substrates and epitaxial wafers
Simultaneous 360° inspection of wafers (defect inspection on the front, back,and edges of the wafer)
Simultaneous and accurate measurement of wafer chamfer and diameter(optional)
The opto-mechanical system with independent intellectual property rights can achieve high resolution, high detection rate and high detection rate
Wafer thickness, TTV/Warp/Bow and other parameters measurement (optional)
Advantage
Image enhancement technology: highlight edge chipping, cracks, surface scratches, stains and other defective features;
Abundant Condition Combination Judgment Parametric Detection Tools: A variety of high-precision detection algorithm tools, with a high degree of adaptability, can accurately judge and identify defect categories, and accurately classify them;
Wafer chamfering and diameter measurement technology: accurate measurement, fitting, calculation of chamfer and diameter dimensions of edge contour, wafer diameter Functional modularization: The inspection software function is modular, and the inspection program (Recipe) can be quickly configured to meet the customer's personalized inspection needs (optional);
Defect diagram: data retention for defect review.
